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Sub contractor for high sophisticated assemblies of microelectronic microwave and optic components with technologies such as:
 
  • Automated / Manual wire Wedge/Ball Bonding
  • Automated / Manual Dies Attachment
  • Automated / Manual Flip Chip
  • Wafer Dicing
  • Write here your second benefit / reason
GALIL MICROWAVES & MICROELECTRONICS
  • Packaging design such as RF/SHIELD, QFP, PIP Flip CHIP etc.
  • Miniaturization design with CMOC, CCD MEMS etc.
  • Engineering Prototypes production
  • RF Modules / Systems design
  • Electrical testing and tuning up to 70 GHz
  • Failure analyses
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